--- /dev/null
+/*
+ * Copyright 2008 Freescale Semiconductor, Inc.
+ *
+ * This program is free software; you can redistribute it and/or
+ * modify it under the terms of the GNU General Public License
+ * Version 2 as published by the Free Software Foundation.
+ */
+
+#ifndef _DDR_SPD_H_
+#define _DDR_SPD_H_
+
+/*
+ * Format from "JEDEC Standard No. 21-C,
+ * Appendix D: Rev 1.0: SPD's for DDR SDRAM
+ */
+typedef struct ddr1_spd_eeprom_s {
+ unsigned char info_size; /* 0 # bytes written into serial memory */
+ unsigned char chip_size; /* 1 Total # bytes of SPD memory device */
+ unsigned char mem_type; /* 2 Fundamental memory type */
+ unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */
+ unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */
+ unsigned char nrows; /* 5 Number of DIMM Banks */
+ unsigned char dataw_lsb; /* 6 Data Width of this assembly */
+ unsigned char dataw_msb; /* 7 ... Data Width continuation */
+ unsigned char voltage; /* 8 Voltage intf std of this assembly */
+ unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */
+ unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+ unsigned char config; /* 11 DIMM Configuration type */
+ unsigned char refresh; /* 12 Refresh Rate/Type */
+ unsigned char primw; /* 13 Primary SDRAM Width */
+ unsigned char ecw; /* 14 Error Checking SDRAM width */
+ unsigned char min_delay; /* 15 for Back to Back Random Address */
+ unsigned char burstl; /* 16 Burst Lengths Supported */
+ unsigned char nbanks; /* 17 # of Banks on SDRAM Device */
+ unsigned char cas_lat; /* 18 CAS# Latencies Supported */
+ unsigned char cs_lat; /* 19 CS# Latency */
+ unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */
+ unsigned char mod_attr; /* 21 SDRAM Module Attributes */
+ unsigned char dev_attr; /* 22 SDRAM Device Attributes */
+ unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */
+ unsigned char clk_access2; /* 24 SDRAM Access from
+ Clk @ CL=X-0.5 (tAC) */
+ unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */
+ unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */
+ unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/
+ unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */
+ unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */
+ unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */
+ unsigned char bank_dens; /* 31 Density of each bank on module */
+ unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */
+ unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */
+ unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */
+ unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */
+ unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */
+ unsigned char trc; /* 41 Min Active to Auto refresh time tRC */
+ unsigned char trfc; /* 42 Min Auto to Active period tRFC */
+ unsigned char tckmax; /* 43 Max device cycle time tCKmax */
+ unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */
+ unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */
+ unsigned char res_46; /* 46 Reserved */
+ unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */
+ unsigned char res_48_61[14]; /* 48-61 Reserved */
+ unsigned char spd_rev; /* 62 SPD Data Revision Code */
+ unsigned char cksum; /* 63 Checksum for bytes 0-62 */
+ unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */
+ unsigned char mloc; /* 72 Manufacturing Location */
+ unsigned char mpart[18]; /* 73 Manufacturer's Part Number */
+ unsigned char rev[2]; /* 91 Revision Code */
+ unsigned char mdate[2]; /* 93 Manufacturing Date */
+ unsigned char sernum[4]; /* 95 Assembly Serial Number */
+ unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */
+
+} ddr1_spd_eeprom_t;
+
+/*
+ * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM",
+ * SPD Revision 1.2
+ */
+typedef struct ddr2_spd_eeprom_s {
+ unsigned char info_size; /* 0 # bytes written into serial memory */
+ unsigned char chip_size; /* 1 Total # bytes of SPD memory device */
+ unsigned char mem_type; /* 2 Fundamental memory type */
+ unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */
+ unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */
+ unsigned char mod_ranks; /* 5 Number of DIMM Ranks */
+ unsigned char dataw; /* 6 Module Data Width */
+ unsigned char res_7; /* 7 Reserved */
+ unsigned char voltage; /* 8 Voltage intf std of this assembly */
+ unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */
+ unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+ unsigned char config; /* 11 DIMM Configuration type */
+ unsigned char refresh; /* 12 Refresh Rate/Type */
+ unsigned char primw; /* 13 Primary SDRAM Width */
+ unsigned char ecw; /* 14 Error Checking SDRAM width */
+ unsigned char res_15; /* 15 Reserved */
+ unsigned char burstl; /* 16 Burst Lengths Supported */
+ unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */
+ unsigned char cas_lat; /* 18 CAS# Latencies Supported */
+ unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */
+ unsigned char dimm_type; /* 20 DIMM type information */
+ unsigned char mod_attr; /* 21 SDRAM Module Attributes */
+ unsigned char dev_attr; /* 22 SDRAM Device Attributes */
+ unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */
+ unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */
+ unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */
+ unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */
+ unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/
+ unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */
+ unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */
+ unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */
+ unsigned char rank_dens; /* 31 Density of each rank on module */
+ unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */
+ unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */
+ unsigned char data_setup; /* 34 Data Input Setup Time
+ Before Strobe (tDS) */
+ unsigned char data_hold; /* 35 Data Input Hold Time
+ After Strobe (tDH) */
+ unsigned char twr; /* 36 Write Recovery time tWR */
+ unsigned char twtr; /* 37 Int write to read delay tWTR */
+ unsigned char trtp; /* 38 Int read to precharge delay tRTP */
+ unsigned char mem_probe; /* 39 Mem analysis probe characteristics */
+ unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */
+ unsigned char trc; /* 41 Min Active to Auto refresh time tRC */
+ unsigned char trfc; /* 42 Min Auto to Active period tRFC */
+ unsigned char tckmax; /* 43 Max device cycle time tCKmax */
+ unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */
+ unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */
+ unsigned char pll_relock; /* 46 PLL Relock time */
+ unsigned char Tcasemax; /* 47 Tcasemax */
+ unsigned char psiTAdram; /* 48 Thermal Resistance of DRAM Package from
+ Top (Case) to Ambient (Psi T-A DRAM) */
+ unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient
+ due to Activate-Precharge/Mode Bits
+ (DT0/Mode Bits) */
+ unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient
+ due to Precharge/Quiet Standby
+ (DT2N/DT2Q) */
+ unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient
+ due to Precharge Power-Down (DT2P) */
+ unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient
+ due to Active Standby (DT3N) */
+ unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient
+ due to Active Power-Down with
+ Fast PDN Exit (DT3Pfast) */
+ unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient
+ due to Active Power-Down with Slow
+ PDN Exit (DT3Pslow) */
+ unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient
+ due to Page Open Burst Read/DT4R4W
+ Mode Bit (DT4R/DT4R4W Mode Bit) */
+ unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient
+ due to Burst Refresh (DT5B) */
+ unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient
+ due to Bank Interleave Reads with
+ Auto-Precharge (DT7) */
+ unsigned char psiTApll; /* 58 Thermal Resistance of PLL Package form
+ Top (Case) to Ambient (Psi T-A PLL) */
+ unsigned char psiTAreg; /* 59 Thermal Reisitance of Register Package
+ from Top (Case) to Ambient
+ (Psi T-A Register) */
+ unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient
+ due to PLL Active (DT PLL Active) */
+ unsigned char dtregact; /* 61 Register Case Temperature Rise from
+ Ambient due to Register Active/Mode Bit
+ (DT Register Active/Mode Bit) */
+ unsigned char spd_rev; /* 62 SPD Data Revision Code */
+ unsigned char cksum; /* 63 Checksum for bytes 0-62 */
+ unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */
+ unsigned char mloc; /* 72 Manufacturing Location */
+ unsigned char mpart[18]; /* 73 Manufacturer's Part Number */
+ unsigned char rev[2]; /* 91 Revision Code */
+ unsigned char mdate[2]; /* 93 Manufacturing Date */
+ unsigned char sernum[4]; /* 95 Assembly Serial Number */
+ unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */
+
+} ddr2_spd_eeprom_t;
+
+typedef struct ddr3_spd_eeprom_s {
+ /* General Section: Bytes 0-59 */
+ unsigned char info_size_crc; /* 0 # bytes written into serial memory,
+ CRC coverage */
+ unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */
+ unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */
+ unsigned char module_type; /* 3 Key Byte / Module Type */
+ unsigned char density_banks; /* 4 SDRAM Density and Banks */
+ unsigned char addressing; /* 5 SDRAM Addressing */
+ unsigned char res_6; /* 6 Reserved */
+ unsigned char organization; /* 7 Module Organization */
+ unsigned char bus_width; /* 8 Module Memory Bus Width */
+ unsigned char ftb_div; /* 9 Fine Timebase (FTB)
+ Dividend / Divisor */
+ unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */
+ unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */
+ unsigned char tCK_min; /* 12 SDRAM Minimum Cycle Time */
+ unsigned char res_13; /* 13 Reserved */
+ unsigned char caslat_lsb; /* 14 CAS Latencies Supported,
+ Least Significant Byte */
+ unsigned char caslat_msb; /* 15 CAS Latencies Supported,
+ Most Significant Byte */
+ unsigned char tAA_min; /* 16 Min CAS Latency Time */
+ unsigned char tWR_min; /* 17 Min Write REcovery Time */
+ unsigned char tRCD_min; /* 18 Min RAS# to CAS# Delay Time */
+ unsigned char tRRD_min; /* 19 Min Row Active to
+ Row Active Delay Time */
+ unsigned char tRP_min; /* 20 Min Row Precharge Delay Time */
+ unsigned char tRAS_tRC_ext; /* 21 Upper Nibbles for tRAS and tRC */
+ unsigned char tRAS_min_lsb; /* 22 Min Active to Precharge
+ Delay Time */
+ unsigned char tRC_min_lsb; /* 23 Min Active to Active/Refresh
+ Delay Time, LSB */
+ unsigned char tRFC_min_lsb; /* 24 Min Refresh Recovery Delay Time */
+ unsigned char tRFC_min_msb; /* 25 Min Refresh Recovery Delay Time */
+ unsigned char tWTR_min; /* 26 Min Internal Write to
+ Read Command Delay Time */
+ unsigned char tRTP_min; /* 27 Min Internal Read to Precharge
+ Command Delay Time */
+ unsigned char tFAW_msb; /* 28 Upper Nibble for tFAW */
+ unsigned char tFAW_min; /* 29 Min Four Activate Window
+ Delay Time*/
+ unsigned char opt_features; /* 30 SDRAM Optional Features */
+ unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */
+ unsigned char res_32_59[28]; /* 32-59 Reserved, General Section */
+
+ /* Module-Specific Section: Bytes 60-116 */
+ union {
+ struct {
+ /* 60 (Unbuffered) Module Nominal Height */
+ unsigned char mod_height;
+ /* 61 (Unbuffered) Module Maximum Thickness */
+ unsigned char mod_thickness;
+ /* 62 (Unbuffered) Reference Raw Card Used */
+ unsigned char ref_raw_card;
+ /* 63 (Unbuffered) Address Mapping from
+ Edge Connector to DRAM */
+ unsigned char addr_mapping;
+ /* 64-116 (Unbuffered) Reserved */
+ unsigned char res_64_116[53];
+ } unbuffered;
+ struct {
+ /* 60 (Registered) Module Nominal Height */
+ unsigned char mod_height;
+ /* 61 (Registered) Module Maximum Thickness */
+ unsigned char mod_thickness;
+ /* 62 (Registered) Reference Raw Card Used */
+ unsigned char ref_raw_card;
+ } registered;
+ unsigned char uc[57]; /* 60-116 Module-Specific Section */
+ } mod_section;
+
+ /* Unique Module ID: Bytes 117-125 */
+ unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */
+ unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */
+ unsigned char mloc; /* 119 Mfg Location */
+ unsigned char mdate[2]; /* 120-121 Mfg Date */
+ unsigned char sernum[4]; /* 122-125 Module Serial Number */
+
+ /* CRC: Bytes 126-127 */
+ unsigned char crc[2]; /* 126-127 SPD CRC */
+
+ /* Other Manufacturer Fields and User Space: Bytes 128-255 */
+ unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */
+ unsigned char mrev[2]; /* 146-147 Module Revision Code */
+
+ unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */
+ unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */
+
+ unsigned char msd[26]; /* 150-175 Mfg's Specific Data */
+ unsigned char cust[80]; /* 176-255 Open for Customer Use */
+
+} ddr3_spd_eeprom_t;
+
+extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd);
+extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd);
+extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd);
+extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd);
+
+/*
+ * Byte 2 Fundamental Memory Types.
+ */
+#define SPD_MEMTYPE_FPM (0x01)
+#define SPD_MEMTYPE_EDO (0x02)
+#define SPD_MEMTYPE_PIPE_NIBBLE (0x03)
+#define SPD_MEMTYPE_SDRAM (0x04)
+#define SPD_MEMTYPE_ROM (0x05)
+#define SPD_MEMTYPE_SGRAM (0x06)
+#define SPD_MEMTYPE_DDR (0x07)
+#define SPD_MEMTYPE_DDR2 (0x08)
+#define SPD_MEMTYPE_DDR2_FBDIMM (0x09)
+#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A)
+#define SPD_MEMTYPE_DDR3 (0x0B)
+
+#endif /* _DDR_SPD_H_ */
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